Toward the Terahertz Era: A Forward-Looking Roadmap for 6G Communication Materials—The Role and Challenges of High-Frequency, High-Speed Hydrocarbon Resins
Release time：2025-10-21
High-frequency, high-speed hydrocarbon resins have already demonstrated outstanding performance in the millimeter-wave band and are regarded as one of the most promising candidate materials for the 6G era.
Globally, the commercial deployment of 5G is well underway, while cutting-edge research in telecommunications has already turned its attention to the next generation—6G. Beyond mere speed enhancements, 6G networks aim to create an omnipresent infrastructure that seamlessly integrates terrestrial and space‑based domains and intelligently connects every object. Realizing this vision hinges on expanding into higher frequency bands, including millimeter wave and even the terahertz (THz) range. This dramatic leap in frequency poses unprecedented, disruptive challenges for the entire communications industry chain—particularly for the core foundational materials underpinning 6G communications.
Moving from 5G’s sub‑6 GHz and millimeter‑wave bands to the terahertz spectrum—potentially exceeding 100 GHz in 6G—the most significant challenge is the dramatic increase in free-space path loss. As signals propagate through air, attenuation becomes extremely severe, necessitating the minimization of losses across the entire link, without exception, from the signal source all the way to the transmitting antenna. At this point, the intrinsic dielectric loss of circuit substrate materials emerges as a critical factor determining whether reliable communication can be achieved. However, conventional substrate materials exhibit alarmingly high losses at terahertz frequencies, rendering them entirely unsuitable for practical use.
Within this forward-looking framework, high‑frequency, high‑speed hydrocarbon resins—already demonstrating outstanding performance in the millimeter‑wave band—are regarded as one of the most promising candidate materials for the 6G era. Their core competitive advantage stems from a meticulously engineered molecular structure designed to enable “lossless transmission.” Through an advanced hydrogenation process, their molecular chains achieve a high degree of saturation and purity, fundamentally eliminating polar vibrational modes that would otherwise lead to energy absorption and loss under high‑frequency electromagnetic fields. As a result, their dielectric loss factor (Df) remains exceptionally low even at extremely high frequencies, ensuring stable terahertz signal propagation within circuits.
In addition to ultra-low loss, 6G communications demand materials with higher levels of integration and multifunctionality. For example, large‑scale MIMO antenna arrays are evolving toward extremely massive configurations, necessitating tighter integration between antennas and RF chips. Consequently, 6G communication materials must not only exhibit outstanding electrical performance but also offer robust thermal management and exceptional mechanical reliability. High‑performance hydrocarbon resins, with their elevated thermal decomposition temperatures—exceeding 400°C—and tunable coefficients of thermal expansion (CTE), are better compatible with semiconductor chips, effectively addressing the thermal challenges posed by high‑density integration and ensuring the long‑term reliability of complex structures.
Of course, advancing into the terahertz frequency range poses new challenges and opens up fresh avenues for carbon‑hydrogen resins. For instance, further reducing loss at ultra‑high frequencies calls for composite materials incorporating novel low‑loss fillers, while surface‑modification techniques can enhance adhesion to increasingly fine circuit patterns. Moreover, it is necessary to explore new material forms that are better suited for 3D packaging and heterogeneous integration.
In summary, although the final technical standards for 6G have yet to be finalized, market demand for ultra-low‑loss, highly stable materials for 6G communications is already clear. Advanced polymer materials—particularly high‑frequency, high‑speed carbon‑based resins—are gaining a competitive edge in this forward‑looking technological race. With their outstanding performance and substantial optimization potential, these materials will play a pivotal role in shaping the next generation of communication technologies.
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