Desytek® High-Performance Optoelectronic Materials
Providing core resin solutions for 5G/6G, semiconductor packaging, and millimeter-wave radar.
Low dielectric constant · High thermal resistance · Low CTE
The Optoelectronic Materials Division of Disai has established a high-performance materials platform anchored by the core material BCB (benzocyclobutene), focusing on the R&D, manufacturing, and sales of advanced high‑frequency, high‑speed pure hydrocarbon resins such as M9 and M10, along with crosslinking agents, reactive flame retardants, and coupling agents. With outstanding properties—including a low dielectric constant, extremely low dielectric loss, and a high glass transition temperature—these products meet world‑class standards, have earned the trust of leading domestic and international industry players, and have entered a new phase of large‑scale production and application.
Disai New Materials’ high-frequency, high-speed, all‑carbon‑hydrogen resin project has been successfully included in the third batch of the 2024 national special central budget investment plan for the development of advanced manufacturing and modern service industries, and has also been honored with the “2024 China Chemical New Materials Innovative Product” award. From big‑data ultra‑high‑speed transmission and 5G/6G communications to AI supercomputing servers, precision packaging for integrated circuits, and aerospace electronic equipment, the company provides robust, reliable, high‑performance material solutions for a range of strategic emerging industries.
Technological Advantages
Ultra-low dielectric loss
Safeguarding High-Speed Signal Transmission
Low thermal expansion
Ensure the material remains stable and reliable under extreme temperature variations.
High heat resistance
Imparts exceptional high-temperature resistance to the material.
Low-shrinkage curing
Provides a robust and reliable structural guarantee.
Low water absorption rate
Dielectric properties remain stable in humid environments.
Flexible manufacturing process
Composite filler/flame retardant, compatible with prepolymerization or one-step curing.
Main Products
Low-dielectric hydrocarbon resin
DS6205
DS6602
DS6603
Standard BCB crosslinking agent
DS5211
DS5212
DS5216
DS5218
DS5508
Low-temperature BCB crosslinking agent
DS5306
DS5305
Coupling agent
DS5203H
DS5203L
DS5204
Flame retardant
DS7011
DS7012
DS7013
Core Application Scenarios
5G/6G millimeter-wave antennas and base stations
Compatible Product Grade
Modified hydrocarbon resin
Terminal/Customer
5G base station RF module
IC packaging substrate / HBM stacked package
Compatible Product Grade
BCB-modified hydrocarbon resin
Terminal/Customer
Advanced Packaging/High-Bandwidth Memory
1.6T/3.2T switch backplane
Compatible Product Grade
Copper-clad laminate of M9/M10 grade
Terminal/Customer
High-speed data center switch
AI Server GPU Acceleration Card (OAM Board)
Compatible Product Grade
Copper-clad laminate of M8/M9/M10 grade
Terminal/Customer
Computing Chip/Rubin Platform
Quality Management
Achieve IATF 16949 certification to meet the stringent reliability requirements of the semiconductor and telecommunications industries.
Raw material
GC/HPLC purity analysis; halogen XRD monitoring ≤ 500 ppm.
Process
Real-time recording of reaction parameters, with solid content, viscosity, and molecular weight (GPC) analyzed for each batch.
Finished product
10 GHz resonant cavity method for measuring Dk/Df; DSC for determining Tg; TGA for measuring Td; 85°C/85% RH test and thermal shock testing.
Shipment
Each batch is accompanied by a Certificate of Analysis (COA), with traceability to the production lot number.
Contact Information
Building 12, Huangshi Science and Technology City, No. 149 Aoti Avenue, Tieshan District, Development Zone, Huangshi City, Hubei Province
Email：
Telephone：
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