JPCA SHOW 2026 | desytek New Materials invites you to join us in Tokyo!
Release time：2026-06-04
Author：Disai New Materials
Dear partners and valued customers:
The 55th Japan International Electronic Circuit Industry Exhibition (JPCA SHOW 2026) will be held from June 10 to 12, 2026, at the Tokyo Big Sight. As a leading supplier of cutting-edge materials, Disai New Materials cordially invites you to attend the event and join industry peers in exploring and witnessing the technological breakthroughs of next-generation copper-clad laminates (CCL).
Disai New Materials has consistently focused on the research, development, and manufacturing of high-performance electronic materials, dedicated to providing core material solutions for high-frequency, high-speed, low-loss circuit substrates. Leveraging deep technical expertise and a commitment to continuous innovation, we have become a trusted partner to leading global CCL manufacturers.
Flagship Product: Desytek® Low-Dielectric Hydrocarbon Resin
At this exhibition, we will highlight Desytek® low‑dielectric hydrocarbon resin, which offers the following key advantages:
Low CTE: Ensures material stability and reliability under extreme temperature variations.
High Tg: Imparts excellent high-temperature resistance to the material;
Extremely Low Df: Ensuring Reliable High-Speed Signal Transmission;
High Peeling: Provides robust and reliable structural integrity.
Desytek® low‑dielectric‑constant hydrocarbon resins are enabling next‑generation CCLs to achieve lower loss and higher reliability, providing an ideal material platform for electronic packaging, high‑frequency communications, and other applications.
Five major series
Desytek® Low-Dielectric Hydrocarbon Resin
Desytek® Standard BCB Crosslinking Agent
Desytek® Low-Temperature Curing Crosslinking Agent
Desytek® Reactive Halogen-Free Flame Retardant
Desytek® Low-Temperature-Curable Coupling Agent
On-site, we will arrange for technical experts to engage in one‑on‑one discussions with you, providing product information and customized solutions. Whether you are seeking material upgrades or exploring cutting‑edge technology trends, Disai New Materials looks forward to in‑person, in‑depth exchanges with you.
Tokyo in June—see you there!
Booth No.: 2C-17
Date: June 10–12, 2026
Location: East Hall 2, Tokyo International Exhibition Center
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