An Analysis of the Core Differences in Dielectric Properties Between Hydrocarbon Resins and Epoxy Resins
Release time：2026-03-27
In high-frequency, high-speed circuit design, the selection of the substrate material directly determines the quality and efficiency of signal transmission. For a long time, epoxy resins have dominated the PCB market; however, at GHz‑level frequencies, hydrocarbon resins, with their unparalleled dielectric advantages, have become the inevitable choice for high‑performance substrates.
As the global electronic information industry advances into the 5G, 6G, and AI‑driven computing eras, printed circuit boards (PCBs), serving as the medium for signal transmission, are confronting unprecedented frequency challenges. In high‑frequency, high‑speed circuit design, the choice of substrate material directly determines the quality and efficiency of signal transmission. For a long time, epoxy resin has dominated half of the PCB market; however, under GHz‑level operating conditions, Hydrocarbon resin With its unparalleled dielectric advantages, it has become the inevitable choice for high-performance substrates.
I. Molecular Structure Determines the Dielectric Nature
The fundamental differences in performance between epoxy resins and hydrocarbon resins stem from their microscopic chemical structures. Conventional epoxy resins contain a large number of highly polar functional groups, such as hydroxyl and ether linkages, within their molecular chains. Under the influence of a high-frequency electric field, these polar groups undergo vigorous dipole reorientation polarization as the field direction alternates, resulting in substantial dielectric losses.
In contrast, Hydrocarbon resin It is primarily composed of nonpolar carbon–hydrogen and carbon–carbon bonds. Its molecular structure is highly symmetrical and exhibits extremely low polarity, resulting in virtually no orientational polarization at high frequencies. This intrinsic physical property endows hydrocarbon resins with inherent advantages in dielectric constant and dielectric loss factor. Typically, the Df of epoxy resins ranges from 0.015 to 0.020, whereas high‑performance hydrocarbon resins can maintain a Df below 0.002—a critical attribute for applications demanding exceptional signal integrity, such as radar systems, antennas, and data centers.
II. Signal Loss and the Leap in Transmission Rate
In PCB design, signal transmission loss is directly proportional to the Df value. Using Hydrocarbon resin The substrate can significantly reduce signal energy loss within the dielectric layer. For high‑frequency signals, low loss translates into longer transmission distances and higher fidelity. Moreover, the lower dielectric constant of hydrocarbon resins—typically ranging from 3.0 to 3.5, compared with FR‑4’s usual value above 4.2—effectively shortens signal propagation delay and enhances system response speed. In millimeter‑wave radar sensing for autonomous driving, this nanosecond‑level speed advantage directly impacts system safety.
III. Comparison of Environmental Stability and Reliability
In addition to its basic electrical properties, hydrocarbon resin also outperforms epoxy resin in terms of environmental reliability. Epoxy resins exhibit a certain degree of water absorption; as highly polar molecules, water ingress into the substrate can significantly increase both the dielectric constant (Dk) and the dissipation factor (Df), leading to impedance mismatch in the circuit. By contrast, hydrocarbon resin boasts excellent hydrophobicity, with a water absorption rate typically below 0.05%, ensuring that printed circuit boards maintain stable electrical performance even under extreme high‑temperature and high‑humidity conditions.
Meanwhile, in conjunction with advanced crosslinking agents and coupling agents, Hydrocarbon resin Copper-clad laminates (CCL) exhibit excellent thermal and dimensional stability, withstand multiple thermal shocks during lead-free soldering, and do not delaminate or experience via cracking.
Although epoxy resins offer advantages in terms of cost and processing maturity, carbon‑hydrogen resins have become an irreplaceable core substrate in high‑frequency, high‑speed applications. Desytek has devoted itself to the modification and R&D of high‑performance carbon‑hydrogen resin systems; through systematic formulation optimization, it has not only overcome the challenge of poor adhesion inherent in carbon‑hydrogen materials but also translated their exceptional dielectric properties into a key competitive edge for end products. In the race to select substrates for high‑frequency PCBs, choosing carbon‑hydrogen resins means embracing the path to future‑proof communication efficiency.
Disai New Materials It is an innovation leader in advanced optoelectronic materials. Its main products include: Hydrocarbon resin, high-frequency and high-speed hydrocarbon resin, crosslinking agent, coupling agent, reactive flame retardant . Please feel free to call us at 027-81801908 or 13971395740 (same number on WeChat). We will provide you with tailored, professional services!
Hydrocarbon resin,High-performance hydrocarbon resin
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