Standard BCB crosslinking agent
Category:
High crosslink density, increased Tg, reduced CTE, cured at 200–280°C.
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Product Introduction
Features and Benefits
1. DS6205 is a pure hydrocarbon resin containing BCB‑active functional groups. Upon curing, it exhibits excellent planarity and thermal stability, along with favorable properties such as a low dielectric constant and dielectric loss, a small coefficient of thermal expansion, and high peel strength. Comparative tests demonstrate that its overall performance offers a significant competitive advantage.
2. DS6205 is used in advanced manufacturing fields such as the production of high‑end CCLs and chip packaging, including M8, M9, and M10 substrates.
3. This product exhibits high reactivity and can be flexibly formulated with other unsaturated resins and monomers, thereby highlighting its outstanding performance.
Structural features
DS6205 contains a high density of unsaturated double bonds and benzocyclobutene reactive groups; it requires no initiator and can undergo self‑polymerization or thermally cure with other unsaturated‑bond‑containing materials, forming six‑membered or eight‑membered ring structural units. This results in cured materials with a higher glass transition temperature (Tg) and improved thermal stability, lower coefficient of thermal expansion (CTE), and excellent electrical properties.
App Features
The DS6205 formulation can be cured by heating at 170–220°C; higher temperatures accelerate curing, making it easy to handle and offering process flexibility.
Technological Advantages
Production Line Overview
Contact Information
Building 12, Huangshi Science and Technology City, No. 149 Aoti Avenue, Tieshan District, Development Zone, Huangshi City, Hubei Province
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Telephone：
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